LONDON: Transense Technologies plc, a U.K.-based developer of Surface Acoustic Wave (SAW) sensor systems, has signed a licensing and supply agreement with ISI Interconnect Systems, a Molex company, to package and distribute its proprietary SAW Application Specific Integrated Circuit (ASIC) technology in the United States.
The deal, finalized after a year of technical and commercial development, marks a key step in Transense’s expansion into the U.S. defense and aerospace markets. Under the agreement, ISI will handle final device packaging at its semiconductor facility in Camarillo, California, creating a domestic supply chain for Transense’s ASIC technology.
The ASIC, a critical component in SAW torque and temperature sensors, is used in electronic control units requiring high-precision signal processing. The packaging process converts bare die chiplets into rugged, surface-mount components suitable for demanding applications, including aerospace engine torque sensing.
Ryan Maughan, Transense’s managing director, said the partnership enhances supply chain security for U.S. customers. “Establishing an ASIC packaging solution in the U.S. improves responsiveness and logistics,” he said. “ISI’s expertise ensures the quality and reliability of these components as we grow our U.S. presence.”
Tom Casey, ISI’s vice president, added: “Our Camarillo facility is well-suited for this precision work, and we’re proud to support Transense in delivering innovative technology to critical U.S. sectors.”
The agreement is expected to generate significant revenue for Transense, driven by forecasted demand from defense and aerospace customers. The U.S.-based production streamlines supply chain resilience amid global electronics manufacturing challenges.