EnSilica plc (AIM: ENSI), a leader in mixed-signal application-specific integrated circuits (ASICs), announced the signing of a binding Memorandum of Understanding (MoU) with a major European satellite operator. The agreement includes a contract for a feasibility study to develop a high-value satellite payload ASIC.
The feasibility study is set to begin this month, contributing non-recurring engineering revenues to EnSilica’s current and next financial years. A successful outcome could lead to the development of a custom ASIC for use in the payload of a communications satellite.
EnSilica specializes in radio frequency (RF) and communications technology, with expertise in chips for satellite payloads, user terminals, modems, and positioning and timing receivers. The company expects increased market activity in these areas, especially as geopolitical tensions highlight the importance of technologies critical for defense and government applications.
“We’re delighted to announce this significant agreement with one of Europe’s leading satellite operators,” said Ian Lankshear, CEO of EnSilica. “This custom chip is intended to provide key differentiation to the satellite operator’s services, enhancing its market offering.”
Lankshear also noted the growth of the satellite communications sector, driven by significant private and government investments amid current geopolitical instability. The company plans to explore more commercial opportunities in the rapidly expanding market.